About MIWAI
Artificial Intelligence (AI) research has broad applications in real-world problems. Examples include control, planning and scheduling, pattern recognition, knowledge mining, software applications, strategy games and others. The ever-evolving needs in society and business both on a local and on a global scale demand better technologies for solving more and more complex problems. Such needs can be found in all industrial sectors and in any part of the world.
The International Conference on Multi-disciplinary Trends in Artificial Intelligence (MIWAI), formerly called The Multi-disciplinary International Workshop on Artificial Intelligence, is a well-established scientific venue in the field of artificial Intelligence. MIWAI was established more than 18 years ago. This conference aims to be a meeting place where excellence in AI research meets the needs for solving dynamic and complex problems in the real world. The academic researchers, developers, and industrial practitioners will have extensive opportunities to present their original work, technological advances and practical problems. Participants can learn from each other and exchange their experiences in order to fine-tune their activities in order to help each other better. The main purposes of the MIWAI series of conferences are:
- To provide a meeting place for AI researchers and practitioners.
- To inform research students about cutting-edge AI research via the presence of outstanding international invited speakers.
- To raise the standards of practice of AI research by providing researchers and students with feedback from an internationally-renowned program committee.
Call for Papers
Artificial intelligence is a broad area of research. We encourage researchers to submit papers in the following areas but not limited to:
Scope and Topics
- Machine Learning & Deep Learning
- Neural networks and representation learning
- Reinforcement learning and decision-making
- Explainable AI and trustworthy ML
- Natural Language Processing & Speech Recognition
- Large language models and generative AI
- Multimodal AI and human-AI interaction
- Sentiment analysis and discourse modeling
- Computer Vision & Image Processing
- Object detection and scene understanding
- Medical imaging and biometrics
- AI-driven creative applications (e.g., art, design, and multimedia)
- Robotics & Autonomous Systems
- AI for robotics and intelligent automation
- Multi-agent systems and swarm intelligence
- Human-robot interaction
- AI for Society, Ethics & Applications
- AI for healthcare, finance, and smart cities
- Ethical AI, bias mitigation, and fairness
- AI-driven education and learning analytics
- AI Theory & Algorithms
- Computational intelligence and optimization
- Knowledge representation and reasoning
- Probabilistic modeling and uncertainty in AI
- Agentic AI
- Defining agency in AI
- Reinforcement learning in agentic AI systems
- Multi-agent coordination and negotiation strategies
- Handling uncertainty and risk in agentic AI decision-making
- Large Language Model
- Interpretability and Explainability
- Alignment and Safety
- Multilingual & Cross-Lingual Learning
- Agentic AI with LLM
Submission Guidelines
Submission link: https://www.easychair.org/conferences/?conf=miwai2026
Both research and application papers are solicited. All submitted papers will be carefully peer-reviewed on the basis of technical quality, relevance, significance, and clarity.
Each paper should have no more than twelve (12) pages in the Springer-Verlag LNCS style. The authors' names and institutions should not appear in the paper. Unpublished work of the authors should not be cited. Springer-Verlag author instructions are available at: https://www.springer.com/gp/computer-science/lncs/conference-proceedings-guidelines
Registration
For the authors of the accepted papers
The authors of each accepted paper must upload the camera ready version of the paper to MIWAI 2026’s submission website via Easychair by August 14, 2026 at 23:59 UTC-12. The camera ready version includes:
- The final pdf file of the paper which has accommodated the reviewers’ comments.
- A zip file of all the source files (LaTeX files with all the associated style files, special fonts and eps or bib files, or Word or rtf files).
- The pdf file of the signed copyright form.
The authors of each accepted paper must send us a signed copyright form. One author may sign on behalf of all of the authors of a particular paper. The copyright form must be present and correct. In the first three fields of the form, insert the following information:
- Proposed Title of the Contribution: [ ]
- Author(s) Full Name(s): [ ]
- Corresponding Author Name: [ ]
The copyright form can be downloaded here.
Each accepted paper should have a registration fee paid by at least one of the authors by September 4, 2026, at 23:59 UTC-12 in order to include the paper in the LNAI proceedings. The fee details are given in the table below.
Important Note: At least one author of each accepted paper must register for the conference in order for their paper to be included in the LNAI. Additional (co)authors of that paper may also register if they wish to.
For non-authors
The early registration fee (Early-bird or before August 14, 2026) and the late registration fee (after August 14, 2026) is given in the table below.
What the registration fee will cover
The registration fee covers conference attendance and other planned services. There will be morning and afternoon breaks and lunches on October 10-12, 2026. The gala dinner will be held on the evening of October 11, 2026.
Registered authors will have access to the online version of the LNAI proceedings before and during the conference.
Note: The conference organizers WILL NOT be responsible for missing payments and/or any other problems related to the payments. The registration fee is non-refundable.
| Attendee Category | Registration Type | Early-bird Fee (USD / CDN) (On and Before August 14, 2026) |
Regular Fee (USD / CDN) |
Register & Pay |
|---|---|---|---|---|
| Presenter | Online/Virtual | 350 / - | 450 / - |
[TBA] Early-bird Fee extended to August 19, 2026, @23:59UTC-12. |
| In-person | 500 / 700 | 600 / 840 | Register & Pay | |
| Participant | In-person | 200 / 280 | 300 / 420 | Register & Pay |
| Workshop | In-person | 150 / 210 | 150 / 210 | Register & Pay |
|
Current time:
|
||||
MIWAI Committee
Steering Committee
- Arun Agarwal, Zen Technologies Ltd, India
- Richard Booth, Cardiff University, UK
- Patrick Doherty, Linköping University, Sweden
- Rina Dechter, University of California, Irvine, USA
- Leon Van Der Torre, University of Luxembourg, Luxembourg
- Peter Haddawy, Mahidol University, Thailand
- Jérôme Lang, Université Paris-Dauphine, France
- Atul Negi, University of Hyderabad, India
- Somnuk Phon-Amnuaisuk, Universiti Teknologi Brunei, Brunei
- Paul Weng, Duke Kunshan University, China
- Quan Thanh Tho, Ho Chi Minh City University of Technology (HCMUT), Vietnam
Conveners
- Chattrakul Sombattheera, Mahasarakham University, Thailand
- Raghava Morusupalli, CVR College of Engineering, India
General Co-chairs
- Chattrakul Sombattheera, Mahasarakham University, Thailand
- Jun Shen, University of Wollongong, Australia
- Hung Son Nguyen, University of Warsaw, Poland
Program Co-Chairs
- Sheela Ramana, University of Winnipeg, Canada
- Mengjun Hu, University of Manitoba, Canada
- Daphne Teck Ching Lai, Universiti Brunei Darussalam, Brunei
Program Committee
- A Vani Vathsala, CVR College of Engineering, India
- Abdelrahman Elfaki, University of Tabuk, Saudi Arabia
- Ahmad Hidayatullah, Universitas Islam Indonesia, Indonesia
- Ahmad-Sahban Rafsanjani, Sunway University, Malaysia
- Akhter-M. Rather, Great Lakes Institute of Management, India
- Akshata Bhat, Amazon, USA
- Alok Singh, University of Hyderabad, India
- Aneesh Krishna, Curtin University, Australia
- Aniqua-Nusrat Zereen, Mahidol University, Thailand
- Arjun Warrier, IBM Corporation, USA
- Ashish Garg, Sam's Club, USA
- Asker Shariff, Amazon, USA
- Athirah-Mohd Ramly, University of East London, UK
- Azizi Ab-Aziz, Universiti Utara Malaysia, Malaysia
- Banoth Samya, CVR College of Engineering, India
- Bay Vo, HUTECH University, Vietnam
- Binh Kieu-Do-Nguyen, EdgeCortix, Japan
- Boon-Giin Lee, The University of Nottingham Ningbo China, China
- Broderick Crawford, Pontificia Universidad Catolica de Valparaiso, Chile
- Bui-Thanh Hung, Industrial University of Ho Chi Minh City, Vietnam
- Chidchanok Lursinsap, Chulalongkorn University, Thailand
- Chilamakuru Raghavendra, CVR College of Engineering, India
- Chirag Agrawal, IEEE, USA
- Chunlai Zhou, Renmin University of China, China
- Costin Badica, University of Craiova, Romania
- Cuong Pham-Quoc, Ho Chi Minh City University of Technology, Vietnam
- D.Teja Santosh, CVR College of Engineering, India
- Dang-Khoa Vo, Industrial University of Ho Chi Minh City, Vietnam
- Dayang-Norhayati-Abang Jawawi, Universiti Teknologi Malaysia, Malaysia
- Doan Dang, Eastern International University, Vietnam
- Duc-Dung Nguyen, Hochiminh City University of Technology, Vietnam
- Duc-Dung Nguyen, Vietnam Academy of Science and Technology, Vietnam
- Duong-Duc Tin, Ho Chi Minh City University of Technology, Vietnam
- Fabien Baldacci, LaBRI (University of Bordeaux), France
- Farrukh Hassan, Sunway University, Malaysia
- Frieder Stolzenburg, Harz University of Applied Sciences, Germany
- George Obaido, University of California Berkeley, USA
- Godavari Modalavalasa, Banking and Financing United States, USA
- Haji Gul, Universiti Brunei Darussalam, Brunei
- Han Fang, Shanghai Jiao Tong University, China
- Ha-Xuan Son, RMIT, Vietnam
- Hien-D. Nguyen, University of Information Technology (UIT), VNU-HCM, Vietnam
- Hoang-Anh Pham, Ho Chi Minh City University of Technology (HCMUT), VNU-HCM, Vietnam
- Hoang-H. Nguyen, University of Tennessee at Chattanooga, USA
- Hong-Son Trang, Hoa Sen University, Vietnam
- Hui-Ngo Goh, Multimedia University, Malaysia
- Hung-Son Nguyen, University of Warsaw, Poland
- Hürevren Kılıç, Atilim University, Turkey
- Iman Dehzangi, Rutgers University, USA
- Isara Anantavrasilp, King Mongkut's Institute of Technology Ladkrabang (KMITL), Thailand
- Jae-Young Hur, Jeju National University, South Korea
- Jayapragash Dakshnamurthy, Independent Researcher, USA
- Jia-Jan Ong, Tunku Abdul Rahman University (TAR UMT), Malaysia
- Jingtao Yao, University of Regina, Canada
- Jinguang Gu, Wuhan University of Science and Technology, China
- Johanna Ahmad, Universiti Teknologi Malaysia, Malaysia
- John Blake, University of Aizu, Japan
- Joi-San Tan, Universiti Tunku Abdul Rahman, Malaysia
- Jysoo Lee, KAUST, Saudi Arabia
- K Venkatesh Sharma, CVR College of Engineering, India
- Karthik Karunanithi, IBM Corporation, USA
- Kejun Dong, China Internet Network Information Center (CNNIC), China
- Kevin Kam Fung Yuen, Hong Kong Polytechnic University, Hong Kong
- Khanista Namee, King Mongkut's University of Technology North Bangkok (KMUTNB), Thailand
- Kiet-Van Nguyen, University of Information Technology (UIT), VNU-HCM, Vietnam
- Kittichai Lavangnananda, University of Luxembourg, Luxembourg
- Kok Lim Yau, Universiti Tunku Abdul Rahman (UTAR), Malaysia
- Krishna Balusu, Meta, USA
- Krishna-Chaitanya Balusu, Meta Platforms, Inc., USA
- Kunal Arya, Progressive Leasing, USA
- Laszlo T. Koczy, Budapest University of Technology and Economics, Hungary
- Latha Kiran, Jayanti Clinic, India
- Le-Duc Anh, Center for Open Data in the Humanities (CODH), Japan
- Le-Duy-Lai Nguyen, Ho Chi Minh City University of Technology, Vietnam
- Lee-Kien Foo, Multimedia University Malaysia, Malaysia
- Le-Hong Trang, Ho Chi Minh City University of Technology, Vietnam
- Le-Nguyen-Hoai Nam, VNUHCM - University of Science, Vietnam
- Long-Phuoc Ton, Industrial University of Ho Chi Minh City, Vietnam
- Long-Tan Le, The University of Sydney, Australia
- Luigi-O. Freire, UTC, France
- M Phani-Krishna-Kishore, Gayatri Vidya Parishad College of Engineering, India
- Mahesh Munjala, CSI, India
- Maitrik Patel, Apple, USA
- Manegaouindé-R Tougma, Université Joseph KI-ZERBO, Burkina Faso
- Mariusz Wzorek, Linkoping University, Sweden
- Masayuki Ida, Aoyama Gakuin University, Japan
- Matthew-Y.-W. Teow, PSB Academy, Singapore, Singapore
- Milan Kumar Rana, University of the Cumberlands, USA
- Monchai Kooakachai, Chulalongkorn University, Thailand
- Mudita Uppal, Chitkara University, India
- Neetu Uthaman, T-mobile, USA
- Nguyen Tien-Huy, University of Science HCM, Vietnam
- Nguyen Tuan-Dang, Saigon University, Vietnam
- Nguyen Tuan-Khoi, Ho Chi Minh City University of Technology, Vietnam
- Nguyen Quoc-Minh, Ho Chi Minh City University of Technology (HCMUT), Vietnam
- Nguyen-Hong-Buu Long, VNUHCM - University of Science, Vietnam
- Nguyen-Thi-Thuy Loan, International University, VNU-HCM, Vietnam
- Nick Pham, Cardiff University, UK
- Nikhil Devnani, Apple, USA
- Nikhil Singh, Amazon, USA
- Noor-Hidayah Zakaria, Universiti Teknologi Malaysia, Malaysia
- Nor-Azliana-Akmal Jamaludin, Universiti Pertahanan Nasional Malaysia (UPNM), Malaysia
- Nor-Azura Husin, UPM (Universiti Putra Malaysia), Malaysia
- Pappula Madhavi, CVR College of Engineering, India
- Peter Scully, Mahidol University, Thailand
- Pham-Duc Thinh, Nanyang Technological University, Singapore
- Phan-Tran-Minh Khue, Open University, Vietnam
- Phu Pham, HUTECH University, Vietnam
- Prakash Hiremath, KLE Technological University, India
- Quoc Duy-Nam-Nguyen, Osaka Metropolitan University, Japan
- Raghava Morusupalli, CVR College of Engineering, India
- Raja Kumar, Taylor's University, Malaysia
- Ratnam Dodda, CVR College of Engineering, India
- Saddam Hussain, Universiti Brunei Darussalam, Brunei
- Saiteja Jonnalagadda, CVS Health, USA
- Sandhya Banda, Maturi Venkata Subba Rao (MVSR) Engineering College, India
- Shing-Chiang Tan, Multimedia University, Malaysia
- Sivaramakrishnan Narayanan, Toyota Financial Services, Japan
- Sj Tan, Universiti Teknologi Brunei, Brunei, Brunei
- Sook-Ling Chua, Multimedia University, Malaysia
- Srinivas Jvs, DVR College of Engineering and Technology, India
- Srinivasa-Raju Rudraraju, Vishnu Institute of Technology, India
- Suguru Ueda, Saga University, Japan
- Sunil-Kumar Vadlamani, Microsoft, USA
- Suradej Intagorn, Mahidol University, Thailand
- Swamy Biru, JPMorgan Chase & Co., USA
- Tai-Tan Mai, Dublin City University, Ireland
- Tanvi Shah, Slalom Consulting, USA
- Tasnim Ferdous, BRAC University, Bangladesh
- Tham Vo, Nguyen Tat Thanh University, Vietnam
- Thanh-Dang Diep, Ho Chi Minh City University of Technology, Vietnam
- Thanh-Duc Chau, University of Science, HCMUS, Vietnam
- Thanh-Tuan Thai, Jeju National University, South Korea
- Thanh-Van Le, Ho Chi Minh City University of Technology, Vietnam
- Thao Nguyen-Thi-Ai, University of Technology HCM, Vietnam
- Thi-Thu-Hong Phan, FPT University, Vietnam
- Tho Quan, Hochiminh City University of Technology, Vietnam
- Thuy-An Nguyen, Ho Chi Minh City University of Technology and Engineering, Vietnam
- Tien-Dung Cao, Tan Tao University, Vietnam
- Tilottama Goswami, Vasavi College of Engineering, India
- Tran-Ngoc Thinh, Ho Chi Minh City University of Technology, Vietnam
- Tran-Thanh Tung, International University, VNU-HCM, Vietnam
- Trinh Tan-Dat, Sai Gon University, Vietnam
- Trong-Nhan Phan, HCMC University of Technology, Vietnam
- Trong-Thuc Hoang, The University of Electro-Communications (UEC), Japan
- Truc Nguyen, National Renewable Energy Laboratory, USA
- Truong Vinh-Lan, Ho Chi Minh City University of Technology, Vietnam
- Tu Vu, Chonnam National University, South Korea
- Tuan-Anh Tran, Ho Chi Minh City University of Technology (HCMUT), Vietnam
- Tuan-Phat Tran-Truong, Ho Chi Minh City University of Technology, Vietnam
- Tung Le, VNU-HCM, University of Science, Vietnam
- Umar Yahya, Universiti Islam Sultan Sharif Ali, Brunei
- Usama Manzoor, Universiti Brunei Darussalam, Brunei
- Van Thien-Hoang, Ho Chi Minh City University of Technology, Vietnam
- Vandana Chaturvedi, JPMorgan Chase & Co, USA
- Van-Iyn Kok, Universiti Kebangsaan Malaysia, Malaysia
- Van-Lam Ho, Quy Nhon University, Vietnam
- Viet-Hung Nguyen, Clermont Auvergne University, France
- Vikram Neerugatti, Jain (Deemed-to-be) University, India
- Vinh Nguyen-Dinh, FPT University, Vietnam
- Viplove Goswami, Deloitte, USA
- Virach Sornlertlamvanich, Musashino University, Japan
- Vo Tuan-Binh, Ho Chi Minh City University of Technology, Vietnam
- Vo-Thi-Ngoc Chau, Ho Chi Minh City University of Technology, Vietnam
- Vuong-M. Ngo, Dublin City University, Ireland
- Wei-Chuen Yau, Xiamen University Malaysia, Malaysia
- Weng-Kin Lai, Tunku Abdul Rahman University (TAR UMT), Malaysia
- Xuân-Bách Lê, Ho Chi Minh City University of Technology, Vietnam
- Yu-N Cheah, Universiti Sains Malaysia, Malaysia
- Yunli Lee, Sunway University, Malaysia
- Zaharaddeen Lawal, Federal University Dutse, Nigeria
Publicity Co-chairs
- Daphne Teck Ching Lai, Universiti Brunei Darussalam, Brunei
- Panich Sudkhot, Zyntelligent Co., Ltd., Thailand
- Benjawan Intara, Mahasarakham University, Thailand
Local Organizing Co-chairs
- Pawan Lingras, Saint Mary's University, Canada
Tutorials
- TBA
Industry Panels
- TBA
Web Administration
- Panich Sudkhot, Zyntelligent Co., Ltd., Thailand
Important Dates
Due to several requests, the deadlines are EXTENDED. All deadlines are in the UTC-12 timezone.
| Event | Date |
|---|---|
| Submission Deadline | June 8, 2026 → July 8, 2026 |
| Notification Deadline | July 15, 2026 → August 1, 2026 |
| Camera Ready Deadline | August 7, 2026 → August 14, 2026 |
| Registration Deadline | August 28, 2026 → September 4, 2026 |
| Conference Dates | October 10-12, 2026 |
| *Note: These dates are the FINAL DEADLINES. | |
|
Current time:
|
|
Organized By
Official Partners
Host
Pawan Lingras
|> Email: miwai26@cs.smu.ca